Aerospace, Telecom, Military & High Reliability

Cirtek  Aerospace, Telecom,  Military  & High Reliability
products   are   packaged   in  ceramic   substrate,  TO
(Transistor  Outline)    metal   can   headers,   ceramic
leadless  chip  carrier,  ceramic  flatpack   and  custom
ceramic   package   consigned   by   customer.   Cirtek
devices  in  production  are   Hybrid  Oscillator  Circuit,
Amplifier  Circuits,  Microwave  and  RF  Modules   and
Opto Relay / Chip Switch Assembly.

Cirtek  Hybrid  Oscillator Circut  final  product  appears
as  either  rectangular or a  square cavity module on a
can-capped  gold header.  Ceramic  substrate   module
contain  semiconductor  chips,  transistors  and diodes,
capacitors,  and  inductors.  The  addition  of  a crystal
blank  into  this  combination  of   active   and  passive
electronic    components   completes     the    oscillator
circuit.  Hermeticity  is  guaranteed  to  meet   Mil  Std
883  leak  rates.   Finished   products  undergo   100%
parametric   testing   and  visual   inspection   prior  to
shipment.

Amplifier   Circuits   hybrid    assembly   is   dependent
largely  on  an  active device  emanating from  a  GaAs
thin wafer technology.  This  chip combines with one or
two  chip  capacitors  in  a  Silicon  MOS technology  to
complete  a  low-noise,   high  power  amplifier  circuit.
The final  product is  a hermetically sealed  package for
surface  mount applications.  Parts  undergo  100% DC
parametric testing, and then shipped on tape and reel.

Microwave  and RF Modules  are assembled in  multiple
sets;  each  set  could  be  similar  with  the  other  set.
A  ceramic  substrate  and  FR-4  PCB  are used.  Diode
Capping  for  cavity-type  use  lid  with  B-stage  epoxy.
Parts are top branded and shipped on tape and reel.