Categories
Custom & Hybrid Assemblies
Cirtek's Custom and Hybrid Assemblies is the
advanced technology of placing multiple ICs, passive
components, opto couplers and crystal oscillators into
a single package. Cirtek hybrid assemblies in
production are Multichip Diode Array, Plastic Molded
Oscillator / Half-Full Duplex Communication Modules
and Opto relay solid-state switches.
Multichip Dioded Array line produces various
configurations of multiple diodes mounted on a silver
spot plated copper substrate. The final product comes
out in different options like a dual-in-line or a single-
in-line through hole board insertions or a small outline
surface mounted package.
Plastic Molded Oscillators / Half - Full Duplex
Communication Modules components mounted onto
the circuit include IC chip, capacitors and crystal in
sealed form supplies ready for mounting. The
mounting is done automatically with the sequence
defined such that there is no disturbance to mounted
components.
Opto Relay Solid State switches are assembled using
LED and control IC (photovoltaic generators). The IC
is coupled to LED by dome coating using a clear,
transparent silicone material with corresponding
shape, height and pattern.
LEAD COUNT | PACKAGE DRAWING | BOND SHELLS |
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SNV 8711
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SVN 8608
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SVN 8596
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SVN 8612
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SNV 4381
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SNV 4353
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SNV 4324
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SOIC WB 16L 01
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SNV 4229
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SNV 4401
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SNV 4387
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SNV 4383