SMT

 

To  meet  the changing  needs  of  the  communication
equipment  market,  Cirtek  houses  an  SMT  (Surface
Mount Technology) production area equipped with high
capacity,  high  speed   and   precision   chip   mounter
machines  with  fine  pitch capability.  In  addition,  the
facility  includes  process and  test equipment  such  as
screen  printers, reflow  furnaces, frequency  analyzers
and other equipment.  SMT  products manufactured  in
an  RF  module   designed  either   in  a   multi-layered
(10 – 20 layers),  low temperature  co-fired  thick  film
ceramic  or  rigid  high temp PCB / laminate  substrate.
The module involves technology such as chip-on-board
(COB),   standard  IC  assembly,  and   ball  grid  array
(BGA)  processes.  Manufacturing  commences  on  the
Chip-on-Board  process where solder paste  are screen
printed   onto  the  board  at   equally  consistent   and
precise      alignment.      Extremely     high      density
components   among  which   are   the   smallest   chip
capacitors,  are   then   mounted.   Subsequently,   the
board  passes  thru  a  Infra-Red (IR)  or  a  convection
furnace with nitrogen environment for the solder reflow
process.

 

  LEAD COUNT   PACKAGE DRAWING   BOND SHELLS
  8   300   100
  14   300   100
  16   300   100

 

  Spec#   Eff Date   Desc.   Rev.   Outline Drawing
  POD 2L DFN 0.32x0.62 rev C   Download
  POD DFN-2L 0402 0.46 mm thick rev 0   Download
  Spec#   Eff Date   Desc.   Rev.   Outline Drawing
  POD 2L DFN 0.32x0.62 rev C   Download
  POD DFN-2L 0402 0.46 mm thick rev 0   Download

 

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