Adhesive Interface
Cirtek offers various types of die attach technologies to cater to various needs.
- Epoxy is a standard material and are either conductive or non-conductive.
Epoxies come in varying thermal and electrical conductivities. Epoxy is
dispensed automatically. - Sintered Ag technology is now being offered to replace AuSn eutectic
solders for cost reason. A version with higher thermal conductivity
that can replace the AuSi eutectic solder will soon be offered.
Sintered Ag is intended for high power application, on the newer SiC and
GaN devices. - Die attach film (DAF) is a replacement for epoxy where bond line
thickness is critical or when die paddle space is a concern. It
is available in either as conductive or non-conductive and comes in
varying thickness (15 to 30 um). - Au based eutectic perform is still being offered for ceramic packages with
proven reliability.