An interconnect technology designed to address performance requirements of high power semiconductor components, copper clip attach enhances the ever growing demand for improved thermal management, device performance and superior switching times in power devices.
Copper clip attach is typically used in Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) and Isolated Gate Bipolar Transistors (IGBTs) to create a direct electrical and heat path from the drain and source sides of a vertical MOSFET die structure to effectively improve switching times and heat management.
Process Highlights and Capabilities
Compared to traditional methods of interconnect through wire bonding, high power packages such as MOSFETs, IGBTs take advantage of copper clip technology.
Copper clip attach is achieved by dispensing solder to both the substrate and die surface. Initially, solder is dispensed on top of the leadframe pad where the drain side or die bottom will be attached. A second round of solder dispense will be performed on the die surface which will then be attached using copper clip forming an direct electrical path between the lead terminals, die and substrate which is an exposed pad to sink off excess heat. This allows for greater package reliability, better thermal transfer, and ultra-fast switching.