Failure Analysis & Reliability
QA Department has the capability to perform die-surface failure analysis. Equipment for environmental and physical reliability testing are also available used for classifying MSL rating and perform stress tests.
Failure Analysis
- Chemical and mechanical decapsulation
- Cross-sectioning and polishing
- Scanning electron microscopy
- Low and high power magnification inspection
- X-ray
- XRF
Reliability Test
- IR reflow
- Temperature-humidity (TH) stress testing
- Pressure cooker test (PCT)
- Scanning acoustic microscopy
- Temperature cycle
- High temperature storage
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