Adhesive Interface

Cirtek offers various types of die attach technologies to cater to various needs.

1.   Epoxy is a standard material and are either conductive or non-conductive.
     Epoxies come in varying  thermal and  electrical  conductivities.  Epoxy  is
     dispensed automatically.
2.   Sintered  Ag technology is  now  being  offered to  replace  AuSn  eutectic
     solders  for  cost  reason.   A  version  with   higher  thermal  conductivity
     that   can  replace  the   AuSi   eutectic   solder   will   soon   be    offered.
     Sintered Ag is intended for high power application,  on the newer  SiC and
     GaN devices.
3.   Die  attach  film  (DAF)   is  a  replacement   for  epoxy  where  bond  line
     thickness   is   critical  or   when   die  paddle   space   is   a   concern.  It
     is available  in  either  as  conductive  or   non-conductive  and  comes  in
     varying thickness (15 to 30 um).
4.   Au based  eutectic perform is still being offered for ceramic packages with
     proven reliability.